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OKW introduces RAILTEC BP M22

With the introduction of the RAILTEC BP M22, OKW offers an innovative expansion to its existing range of DIN rail enclosures. This compact plastic housing is designed for quick, screwless mounting on DIN rail EN 60715 TH35.

ODU introduces modular push-lock in-line receptacle for tool-free cable-to-cable connections

With the launch of the ODU-MAC® Blue-Line Push-Lock In-Line receptacle, ODU introduces a new modular concept for direct cable-to-cable connections. The connector is specifically designed for use in dynamic environments where reliability, speed, and flexibility are essential—such as in testing equipment, robotics, or medical systems.

New thermoelectric cooling system from Laird

Laird Thermal Systems has launched the OptoTEC™ MBX series

Laird Thermal Systems has launched the OptoTEC™ MBX series, a new line of micro-thermoelectric cooling systems for space-saving optoelectronic applications, with high heat dissipation capacities and efficient temperature stabilization.

New silicone-free thermal fillers from Laird.

flex SF4, Tflex SF7, and Tflex SF10 are innovative, high-performance thermal materials in Laird's silicone-free gap filler portfolio

Tflex SF4, Tflex SF7, and Tflex SF10 are innovative, high-performance thermal materials in Laird's silicone-free gap filler portfolio.

New Smart Displays formats

DWIN launches extended range of Smart Displays in various form factors

DWIN has launched a new display product line featuring 1.6-inch round, 2.1-inch round, 3.7-inch bar, and 4.0-inch square shapes. The Smart Displays come in various shapes and technologies, including COF (Chip-on-Flex), rotary encoder, and COB (Chip-on-Board).

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