Edge AI is becoming increasingly important in industrial environments. Advantech and Qualcomm are working together to bring Snapdragon-based solutions to the edge.

Laird expands its portfolio with the Tflex™ HR 6.5, a gap pad with excellent thermal conductivity (6.5 W/m·K) and impressive mechanical properties. With a rebound of up to approx. 30%, this pad continues to perform reliably after installation and repeated compression

With the launch of the ODU-MAC® Blue-Line Push-Lock In-Line receptacle, ODU introduces a new modular concept for direct cable-to-cable connections. The connector is specifically designed for use in dynamic environments where reliability, speed, and flexibility are essential—such as in testing equipment, robotics, or medical systems.

With the introduction of the RAILTEC BP M22, OKW offers an innovative expansion to its existing range of DIN rail enclosures. This compact plastic housing is designed for quick, screwless mounting on DIN rail EN 60715 TH35.