Heatsinks & Cooling

Thermal Management

Electronics produce heat. Despite enormous advances in electronic circuits and conductors, a great deal of power in each application is still normally converted into (unwanted) heat as a by-product.

And while circuits are becoming more compact and more powerful, the housings are becoming increasingly smaller, so that the need for effective heat extraction is also increasing. Heat sinks are the preferred way to foresee the object to be cooled with as big a surface as possible along which the heat can dissipate. Usually, this extracts into the air.

Thermal Management

It sounds simple, but there is actually a lot involved in selecting the right heat sink. Construction shape, air speed, and the used materials play a major role in the effectiveness of this cooling method. The thermal resistance of the material, the design of the cooling fins, the finishing treatment, and even the colour of the heat sink are factors which determine the efficiency of the cooling. The mounting location of the heat sink is also a factor to be considered.

Thermal Components

  • Fans, possibly with cable and connector
  • Heat pipes & vapor chambers
  • Push pins, plastic & metal
  • Copper heat spreader
  • Thermal interfaces
  • Peltier elements
  • Springs
  • Miscellaneous parts
Thermoelectric Modules & Peltier Elements Thermoelectric Modules & Peltier Elements
  • No moving parts or fluids
  • Perfect for hot spot cooling
  • Light weight
  • Silent
  • Rapid response time
  • Optimal thermal control
Thermoelectric Assemblies Thermoelectric Assemblies
  • Air-to-Air
  • Liquid-to-Air
  • Direct-to-Air
  • Direct-to-Liquid
Liquid Cooling Liquid Cooling
  • Oil or water cooling
  • Liquid to air
  • Air to liquid
  • Recirculation
  • High heat pump capacity
  • High heat flux density
Heat Sinks Heat Sinks
  • CNC-Machining
  • Die-Casting
  • Zippering
  • Stamping
  • Extrusie
  • Forging
  • Skiving
Thermal Interfaces Thermal Interfaces
  • Gap Fillers
  • Thermal Tapes
  • Thermal Pastes
  • Phase Changing Interfaces
  • Electrically Insulating Interfaces
  • Electrically Conductive Interfaces
Fans Fans
  • 3.5 ~ 48V DC Fans
  • 220/230V AC Fans
  • 2/3/4 Wired Fans
  • PWM Regulated RPM
  • Ball / Sleeve Baerings
  • Hypro X Plastic Bearings
Air Filters Air Filters
  • Quadofoam Filters
  • Dual EMI Filters
  • EMI Vent Panels
  • Flex Frame Filters
  • Polyfold Filters
  • Metal Mesh Filters
Heat Pipes Heat Pipes
  • Large Capacity for Heat Transfer
  • No External Power Source Required
  • No Moving Components or Pump
  • Rapid Response
  • Vapor Chambers
  • Hot Spot Cooling
Board Component Cooling Board Component Cooling
  • Pin heatsinks
  • Straight & flared pins
  • Passive cooled heatsinks
  • Forced cooling
  • Thermoelectric solutions
  • Cooling agregates
Thermal Consultancy Thermal Consultancy
  • Thermal Trainings
  • Software Analytics
  • Prototype Validation
  • Pre Compliance Testing
  • Testing Instrumentation
  • Best Time to Market