Tflex™ HR 6.5: Reliable Performance in Automated Assembly - EMC

Published: 08-08-2025

Laird expands its portfolio with the Tflex™ HR 6.5, a gap pad with excellent thermal conductivity (6.5 W/m·K) and impressive mechanical properties. With a rebound of up to approx. 30%, this pad continues to perform reliably after installation and repeated compression.

Long-term testing shows that the Tflex™ HR 6.5 hardly increases in thermal resistance, even after 2,000 compression cycles. In comparison, competing gap fillers show up to 400% more resistance after only 300 cycles, due to poor rebound.

The unique material structure also provides additional protection for sensitive components on the printed circuit board (PCB), without applying excessive pressure. The material offers high resilience, excellent conformability, and maintains its performance despite compression, vibration cycles, shocks, or warping. This flexibility makes the Tflex™ HR 6.5 ideal for automated assembly.

Feel free to contact our specialists for more information, samples, or technical advice.

Contact us