Laird introduces BMI-S-608 - EMC

Laird introduces BMI-S-608 

Expansion of shielding functionality and cost savings

The BMI-S-608 shielding frame from Laird, with its lidless stainless steel design, features rows of integrated contact spring pins placed on each inner wall of the four-sided shield. Traditional shielding lids are not needed when using this new addition to Laird's standard board-level shielding product line. The structure of the shield not only helps reduce EMI but also serves as an integral structural part of the separate cast/heatsink main housing of a manufacturer. The spring pins of the BMI-S-608 directly grip the heatsink housing. This integrates the heatsink directly with the heat-sensitive components of the PCB. The combination of cast/heatsink (lid) and spring pins (frame) provides a shielding solution around the PCB. By reducing the required distance between adjacent shields, making repairs easier, and lowering labor costs, the BMI-S-608 offers additional design flexibility. Automotive/ADAS/AVS, domain and central vehicle controllers, infotainment smart boxes, instrument cluster displays, radio navigation systems, and higher power computing are among the first applications.

Removing complexity from thermal transfer The BMI-S-608 is a one-piece shielding solution with current applications in the automotive sector. No top-mounted lid is applied to the four-sided shielding frame designed to surround heat-sensitive components. Instead, the cast/heatsink main housing is placed directly into the shielding frame and securely clamped by the integrated contact spring pins. The BMI-S-608 provides cost-effective EMI shielding of components while the spring pins create electrical contact and grounding of the cast/heatsink. The tight fit and secure seal of the cast housing ensure it maintains direct, surface-to-surface contact with integrated circuits with high thermal loads.

Features, benefits, and specifications include:

• Improved design freedom regarding PCB layout
• Allows reduction of the distance between adjacent shields
• Makes component repairs easier
• Alternative to solutions from multiple component manufacturers
• Base materials: Stainless steel X10 CrNi18-8, (EN 1.4310)
• Surface plating/finish: Pre-plated matte tin plating: 2-5 μm
• Underlayer nickel: Minimum 1 μm
• Superior solderability and corrosion performance
• Version dimensions: Surface mount device frame 39.6mm 39.6mm 7mm
• Operating temperature: -40°C to +125°C, Short-term +150°C
• Material thickness: 0.2mm
• Flatness/Co-planarity: Typical, <0.10mm

Markets and selected applications:

• Automotive/ADAS/AVS
• Infotainment smart boxes, radio navigation system, instrument cluster displays
• Higher power computing
• Central vehicle controllers
• Domain controllers