New thermal interfaces from Laird
High Deflection Thermal Gap Filler
Laird Tflex HD400 is a 4.0 W/mK gap filling material in our high deflection line of products. Tflex HD400 is an excellent choice when wide manufacturing tolerances occur. These variable gaps can be filled with Tflex HD400 while generating minimal board and component stress. Laird’s unique manufacturing capabilities, filler and resin knowledge result in this advanced product designed with customer applications in mind.
Tflex HD400 is provided in thickness from 1mm (.040”) up to 5mm (.200”) in .5mm (.020”) increments as standard. Non-standard increments of .25mm (.010”) are available if required. Please contact Laird for information and pricing. In addition, Laird can provide Tflex HD400 in multiple converted formats through approved converters and distribution networks. Also, if your application requires, we can deliver sheets of material as large as 230mm (9”) X 230mm (9”).
Dispensable Gap Filler
Laird Tputty™ 508 is a single part dispensable material designed with automation and vertical stability in mind. Laird has leveraged its knowledge of thermally conductive fillers and resin systems to develop a single part dispensable that demonstrates reliability in a variety of application orientations.
Tputty™ 508 is ideal for applications that can benefit from automation, and allows minimization of SKUs in applications with gap variability. In addition to providing application flexibility and variable gap adaptation, Tputty™ 508 will exert minimum stress on your component while maintaining interface contact to maximize thermal transfer. Combined with Laird’s global technical support and global footprint, deploying Tputty™ 508 is easier than ever.
When it is time to integrate Tputty 508 into your production environment Laird can work with your existing dispensing partner or provide recommendations for a dispensing equipment provider.
Hybrid Thermal/EMI Absorber
CoolZorb 500 is a 2nd generation hybrid absorber/thermal management material that is used for EMI mitigation. Product is used like a traditional thermal interface material between heat source such as an IC and heat sink or other heat transfer device or metal chassis. CoolZorb 500 also functions to suppress unwanted energy coupling, resonances or surface currents causing board level EMI issues.